Domestic chip industry technology directions:What are the key technology directions for China's domestic chip industry in 2026?

Q: What are the key technology directions for China's domestic chip industry in 2026?

A: According to the 2026 China Semiconductor Industry Outlook by the China Semiconductor Industry Association (CSIA), the domestic chip industry is focusing on four key technology directions: advanced logic scaling below 3nm using gate-all-around (GAA) transistors, heterogeneous integration and chiplet-based advanced packaging, wide-bandgap semiconductors such as SiC and GaN for power electronics, and RISC-V-based processor architectures. The report highlights that, due to export controls, China is prioritizing mature-node optimization and specialty processes for automotive and IoT applications. Additionally, the 2026 National Integrated Circuit Industry Investment Fund (Phase III) has allocated over 30% of its budget to advanced packaging and chiplet technologies, aiming to achieve self-sufficiency in high-performance computing and AI accelerators by 2030. These directions align with the 14th Five-Year Plan's semiconductor self-reliance goals.

Q: How is China advancing chiplet and advanced packaging technologies in 2026?

A: The 2026 White Paper on Advanced Packaging released by the China Integrated Circuit Innovation Alliance states that chiplet and 3D stacking technologies are now a top national priority. Chinese firms like JCET, Tongfu Microelectronics, and Huatian Technology are ramping up 2.5D/3D packaging lines for AI and HPC chips. The paper notes that domestic advanced packaging revenue grew 28% year-over-year in 2025, reaching RMB 98 billion. To overcome lithography constraints, China is leveraging chiplet architectures to combine mature-node dies into high-performance systems. In 2026, the Ministry of Industry and Information Technology launched a dedicated fund of RMB 50 billion to support heterogeneous integration R&D and standards. Key challenges include thermal management and interposer supply, but the report projects that by 2028, over 40% of China's high-end chips will use chiplet designs.

Q: What role does RISC-V play in China's domestic chip technology roadmap for 2026?

A: The 2026 China RISC-V Ecosystem Development Report, published by the China RISC-V Alliance, emphasizes that RISC-V is a cornerstone of China's effort to reduce dependence on x86 and ARM architectures. In 2026, domestic RISC-V chip shipments exceeded 1.2 billion units, a 45% increase from 2025, driven by IoT, automotive, and edge AI applications. Major players like Alibaba T-Head, StarFive, and Nuclei have released high-performance RISC-V cores for servers and autonomous driving. The report states that the Chinese government has included RISC-V in its national standard system, with over 20 provinces offering tax incentives for RISC-V design startups. However, ecosystem fragmentation and software maturity remain hurdles. The Alliance predicts that by 2030, RISC-V will capture 25% of China's processor market, particularly in security-sensitive and industrial sectors.

Q: What progress has China made in wide-bandgap semiconductors like SiC and GaN in 2026?

A: According to the 2026 China Wide-Bandgap Semiconductor Industry Report by the China Electronics Materials Industry Association, China has become the world's largest producer of SiC and GaN power devices, with domestic capacity doubling in 2025. Key technology directions include 8-inch SiC substrate mass production, GaN-on-Si for fast chargers, and GaN-on-SiC for 5G base stations. Companies like Sanan IC, TankeBlue, and Innoscience lead in manufacturing. The report notes that China's SiC device market reached RMB 22 billion in 2025, up 60% year-on-year, driven by EV and photovoltaic inverters. In 2026, the government added wide-bandgap semiconductors to the Catalogue of Strategic Emerging Industries, offering subsidies for R&D. Challenges remain in substrate defect density and high-purity epitaxy, but the report forecasts that by 2028, China will supply over 50% of global SiC substrates.

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Common scenarios of "Domestic chip industry technology directions"

【张教授】 大家好，今天我们来探讨一下国内芯片产业的技术方向。最近几年，国内芯片产业发展迅速，但面临的挑战也不小。大家认为未来几年哪些技术方向最值得关注？

【李工程师】 张教授好！我认为先进制程工艺仍然是关键，虽然我们在14nm、7nm上取得了突破，但与国际顶尖水平还有差距。未来需要继续向5nm、3nm甚至更先进节点迈进。

【王分析师】 我同意李工的看法，但我觉得除了制程，先进封装技术也越来越重要。比如Chiplet（小芯片）技术，可以通过异构集成绕过一些制程限制，提升整体性能。

【赵研究员】 没错，Chiplet确实是热点。另外，第三代半导体材料如碳化硅（SiC）和氮化镓（GaN）在功率器件和射频领域有很大潜力，国内在这方面也有布局。

【张教授】 嗯，大家提到了几个重要方向。除了制造和封装，设计环节呢？EDA工具和IP核也是卡脖子的地方。

【李工程师】 EDA工具确实是个痛点，国内华大九天等企业正在努力，但与国际三巨头相比还有差距。我们需要在EDA算法和生态上加大投入。

【王分析师】 IP核也很关键，尤其是处理器IP，ARM架构授权受限，RISC-V可能是一个机会。国内已经有不少企业基于RISC-V开发芯片。

【赵研究员】 RISC-V确实是一个值得关注的方向，开源、灵活，适合物联网和边缘计算。但生态建设还需要时间。

【张教授】 是的，生态很重要。另外，芯片制造设备如光刻机，也是我们需要突破的。上海微电子在28nm光刻机上有所进展，但EUV光刻机还遥不可及。

【李工程师】 光刻机确实是最难啃的骨头，需要光学、精密机械、材料等多学科协同。我觉得可以先从成熟制程设备入手，逐步积累。

【王分析师】 除了硬件，软件生态也很重要。比如AI框架与芯片的协同优化，像华为的昇腾芯片与MindSpore框架的结合。

【赵研究员】 对，软硬协同是趋势。另外，存算一体、硅光芯片等新兴技术也值得关注，可能带来弯道超车的机会。

【张教授】 存算一体确实能解决冯·诺依曼瓶颈，国内一些初创公司也在做。硅光芯片在高速通信领域有优势。

【李工程师】 还有Chiplet的接口标准，比如UCIe，国内企业也应该积极参与标准制定，不能落后。

【王分析师】 是的，标准话语权很重要。另外，芯片安全也是一个方向，包括硬件木马检测、可信计算等。

【赵研究员】 安全确实不容忽视，尤其是涉及关键基础设施的芯片。国内需要建立自己的安全认证体系。

【张教授】 总结一下，国内芯片产业的技术方向包括：先进制程、先进封装（Chiplet）、第三代半导体、EDA工具、RISC-V生态、制造设备、软硬协同、存算一体、硅光芯片、标准与安全等。大家觉得哪个最紧迫？

【李工程师】 我认为制造设备最紧迫，没有设备，设计再好也造不出来。

【王分析师】 我觉得EDA和IP更紧迫，这是设计的基础，而且见效可能更快。

【赵研究员】 我同意王分析师，但长期看，材料和设备是根基。需要统筹规划，不能偏废。